METHOD FOR INSPECTING CONTRACTING STATE BETWEEN WAFER HOLDING TOOL AND INSPECTING WAFER, AND INSPECTING WAFER USED THEREIN

摘要

PROBLEM TO BE SOLVED: To inspect preliminarily the contacting state of a wafer holding tool with an inspecting wafer, by noting that the heat conduction between the wafer holding tool and the inspecting wafer changes responding to their contacting state with each other, and by inspecting the change in the color tone of a temperature-sensitive liquid crystal formed on the surface of the inspecting wafer which is put on the wafer holding tool.;SOLUTION: A wafer holding tool 1 for holding an inspecting wafer 10 having on its surface a temperature-sensitive liquid crystal layer is heated or cooled to a temperature, which is lower than the lower limit and in the vicinity of the color changing temperature-range of the temperature-sensitive liquid crystal provided on the inspecting wafer 10, and is close to the temperature-range. The inspecting wafer 10 is heated or cooled to a temperature which exceeds and is in the vicinity of the upper limit of the color changing temperature-range of the temperature-sensitive liquid crystal provided on the inspecting wafer 10. Then, the inspecting wafer 10 is put on the wafer holding tool 1 to inspect their contacting state with each other based on the change in the color tone of the temperature-sensitive liquid crystal provided on the surface of the inspecting wafer 10, which is caused by the heat conduction.;COPYRIGHT: (C)2000,JPO