首页> 外国专利> SOLDER STIRRING UNIT FOR SOLDER PELLET MOUNTING AND SOLDER STIRRING METHOD THEREFOR

SOLDER STIRRING UNIT FOR SOLDER PELLET MOUNTING AND SOLDER STIRRING METHOD THEREFOR

机译:用于焊球安装的焊球搅拌单元及其焊球搅拌方法

摘要

PROBLEM TO BE SOLVED: To spread a solder member on islands of a lead frame and make it adapt to them in a short period with high quality, in a solder stirring unit of a semiconductor pellet mounter.;SOLUTION: A rotatable stirring pin 4 and a reducing gas inlet port 7 are installed on a solder stirring unit 1 the top end of which is recessed, solder 3 is put in a recess 6 while a reducing gas is fed into the recess 6, and the solder 3 on an island 2 of a lead frame 8 is stirred by the stirring pin 4.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:在半导体颗粒安装机的焊料搅拌单元中,将焊接部件散布在引线框架的岛上,并使其在短时间内高质量地适应它们;解决方案:可旋转的搅拌销4和还原气体入口7被安装在焊料搅拌单元1上,该焊料搅拌单元的顶端是凹入的,焊料3被放置在凹部6中,同时还原气体被供给到凹部6中,并且焊料3位于岛的岛2上。引线框8由搅拌销4搅拌。版权所有:(C)2000,JPO

著录项

  • 公开/公告号JP2000124234A

    专利类型

  • 公开/公告日2000-04-28

    原文格式PDF

  • 申请/专利权人 NEC CORP;

    申请/专利号JP19980289289

  • 发明设计人 FUKUMIZU AKIRA;

    申请日1998-10-12

  • 分类号H01L21/52;

  • 国家 JP

  • 入库时间 2022-08-22 01:58:52

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