SOLDER BUMP FORMING APPARATUS CAPABLE OF EFFECTIVELY STIRRING AND HEATING A SOLDER AND A SOLDERING FACILITY INCLUDING THE SAME

摘要

PURPOSE: A solder bump forming apparatus and a soldering facility including the same are provided to improve a formation efficiency of a solder bump by effectively putting a solder into an electrode pad.;CONSTITUTION: A solder bath(120) accommodates a solder. A stirring unit(130) stirs the solder in the inner part of the solder bath. A driver(140) drives the stirring unit. An intake pressure provider(150) provides an intake pressure about a substrate. The intake pressure provider includes a suction chamber and an intake line.;COPYRIGHT KIPO 2013