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Solder bump forming apparatus and soldering facility including the same
Solder bump forming apparatus and soldering facility including the same
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机译:焊料凸块形成设备和包括该焊料凸块形成设备的焊接设备
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摘要
Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.
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