METHOD FOR PRODUCING REWIRING SUBSTRATES FOR SEMICONDUCTOR CHIP PACKAGES

摘要

The invention relates to a method for producing rewiring substrates (CSP) for integrated circuit packages using starting materials consisting of a layer of dielectric (1) and one or two layers of electrically conductive material (2, 20). According to said method current paths and contact surfaces (2', 20') are formed in a layer of electrically conductive material (2, 20) by photochemical structuring, access holes and/or access points (1') are formed in the dielectric (1) by plasma ablation and solder balls (3) are placed into the access holes and/or access points (1') and soldered to the current paths and contact surfaces (2', 20'). According to the invention, integrated circuit packages are formed by electrically joining integrated circuits (5) to the current paths and contact surfaces (2') of the rewiring substrates (CSP) created in this way.