MAGNETICALLY ALIGNABLE SEMICONDUCTOR CHIP AND REWIRING SUBSTRATE AND A METHOD FOR MAGNETICALLY ALIGNING THE SEMICONDUCTOR CHIP AND THE REWIRING SUBSTRATE

摘要

A semiconductor chip (2) comprises at least one first alignment means (7). The first alignment means (7) comprises an electrically conductive inductor (24; 26) for magnetically aligning the semiconductor chip with a rewiring substrate of a semiconductor package. The rewiring substrate (3) includes at least one second alignment means (13) for magnetically aligning the rewiring substrate with a semiconductor chip of a semiconductor package. The second alignment means is disposed underneath an alignment contact pad (14).