POLYAMIDE FILM FOR FINE PITCH BGA PACKAGE

摘要

PURPOSE: A film formed round pin insertion holes at both ends of polyamide film is provided which improves precision of position when the pin is inserted and prevents the periphery of the insertion holes from tearing. CONSTITUTION: The BGA package(11) of fine pitch is formed on a polyamide film(10) through several assembly processes and plural pin insertion holes(12) for inserting round pins(15) are formed at both ends of polyamide film(10). The plural pin insertion holes(12) of round type are more convenient than conventional rectangular pin holes. The pin(15) is used for determining the position of the polyamide film in a working facilities or inserting into the pin insertion holes(12) of the polyamide film to move the polyamide film. This is more effective than conventional rectangular pin in manufacturing and mounting on the facilities.