PRINTED CIRCUIT BOARD FOR FORMING A FINE PITCH, A PACKAGE-ON-PACKAGE SUBSTRATE, AND A METHOD FOR MANUFACTURING A PACKAGE-ON-PACKAGE SUBSTRATE

摘要

PURPOSE: A printed circuit board, a package-on-package substrate, and a method for manufacturing a package-on-package substrate are provided to secure a space between substrates by mounting a solder bump at a desired height in a substrate which has a fine pitch.;CONSTITUTION: A package-on-package substrate comprises a printed circuit board with a lower plate(10), a solder bump(50), and an upper plate(60). The printed circuit board obtains a desired space with the upper plate by including the lower plate, an insulating layer(20), a dam(30), and a bump base(40). The lower plate has a circuit pattern which is necessary for a package. A bump pad(12) for bonding with the upper plate is formed in the upper side of the lower plate. An electrode pad(14) can be formed in the lower plate for connecting with a mounted chip(18).;COPYRIGHT KIPO 2012