BOARD LEVEL RELIABILITY OF FINE PITCH FLIP CHIP BGA PACKAGES FOR AUTOMOTIVE APPLICATIONS

摘要

The drive for higher performance and smaller electronic components make flip chip ball grid array (FCBGA) packages attractive for automotive applications. As automobiles rely more heavily on electronics for passenger safety, efficiency, and comfort, component reliability has become increasingly important. Since automotive components operate in extreme environmental conditions, with a temperature range of -40°C to +125°C, solder joint reliability of ball grid array packages is a major concern in automotive systems. Because of the difference in thermal expansion of the different packaging materials and the printed circuit board (PCB), temperature variations create thermal mismatch, resulting in solder joint stress. After repeated thermal cycling, the solder joints can crack and lead to system failures. In our study, the board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment. The effect of different factors, such as package construction, underfill type, and ball pitch, have on board level reliability of flip chip packages will be discussed. Our studies showed FCBGA packages using organic substrates can achieve high board level reliability under automotive operating conditions.