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Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

机译：低成本倒装芯片板封装的设计，制造和可靠性，用于商业应用最多50 GHz

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Li-Han Hsu; Chee-Way Oh; Wei-Cheng Wu; Edward Yi Chang; Herbert Zirath; Chin-Te Wang; Szu-Ping Tsai; Wee-Chin Lim; Yueh-Chin Lin;
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年度 2012
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1. Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz [J] . Hsu L.-H., Oh C.-W., Wu W.-C., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2012,第3期

机译：低成本，频率高达50 GHz的商业应用的板上倒装芯片封装的设计，制造和可靠性
2. Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology [J] . Alimenti F., Mezzanotte P., Tasselli G., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2012,第8期

机译：利用系统级封装（SiP）方法和商用PCB技术的低成本24 GHz电路的开发
3. DC-50 GHz RF-MEMS SPDT SWITCH FOR HIGH-RELIABILITY APPLICATIONS [J] . Nuria Torres Matabosch, Fabio Coccetti, Bruno Reig, Microwave and optical technology letters . 2013,第2期

机译：适用于高可靠性应用的DC-50 GHz RF-MEMS SPDT开关
4. Low-cost, Active Frequency-Doubler MMIC in SMT Package for 6-20GHz Commercial Applications [C] . Sushil Kumar, Lik-Khai Chia, Henrik Morkner European Microwave Conference vol.2; 20041011-14; Amsterdam(NL) . 2004

机译：采用SMT封装的低成本有源倍频MMIC，适用于6-20GHz商业应用
5. A new low-cost microstrip antenna array for 60 GHz applications. [D] . Joaquin, Darwin J. 2016

机译：一种适用于60 GHz应用的新型低成本微带天线阵列。
6. Design and Fabrication of Low-cost Microfluidic Channel for Biomedical Application [O] . Shailendra Kumar Tiwari, Somashekara Bhat, Krishna K. Mahato -1

机译：低成本生物医学应用微流控通道的设计与制作
7. 50 GHz Broadband SMT Package for Microwave Applications [O] . Katsuyuki Yoshida, Takayuki Shirasaki, Seigo Matsuzono, 2010

机译：用于微波应用的50 GHz宽带smT封装

Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

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