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METHOD OF MANUFACTURING OF SEMICONDUCTOR DEVICE WITH DEVELOPMENT PROCESS A USING WET SOLUTION
METHOD OF MANUFACTURING OF SEMICONDUCTOR DEVICE WITH DEVELOPMENT PROCESS A USING WET SOLUTION
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机译:利用湿法开发具有开发过程的半导体器件的方法
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摘要
PURPOSE: A manufacturing method is provided to improve a uniformity of development and a linearity of photoresist pattern by moving a nozzle contain with a solution of development on a wafer. CONSTITUTION: The manufacturing method comprises the steps: forming a photoresist pattern on a wafer (4); exposing of the photoresist pattern; developing of the photoresist pattern using a nozzle (7) contain with development solution; and moving the nozzle (7) into the center. Thereby, it is possible to improve the uniformity and linearity of photoresist pattern in the development process.
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