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PRECURSOR SOLUTION FOR CHEMICAL VAPOR DEPOSITION OF COPPER FILM AND ITS PREPARING METHOD

机译:铜膜化学气相沉积的前驱体及其制备方法

摘要

For the present invention using a kind of method for manufacturing the precursor solution on silicon substrate, this method has excellent copper wiring film, and the sheet resistance in resistivity and the wiring material to semiconductor devices are moved to electronics vapor deposition electronically. The solution of ion method and its solution and the method for depositing copper film on a silicon substrate, the present invention is dissolved in following formula (1), lewis base is defined by formula (2) to formula (5), the formula (5) is lower than the metal complex defined by the lewis acid of formula (6), or abrasion precursor solution, wherein copper foil increase is dissolved in the chemical substance in lewis base and lewis acidic mixed solution, and provides the method for producing the chemical substance. ;1 & gt of formula; ;In formula 1, R is selected from hydrogen (H), fluorine (F) or alkyl, perfluoroalkyl with 1 to 4 (perfluoroalkyl), perfiuoroaryl (perfiuoroaryl), R 1 and R 2 is carbon atom, each carbon atom is independently 1 to 7, alkyl or perfluoroalkyl, it is the alkene that following formula (2) indicate that L, which is defined as lewis base,, for that can provide the organic or organo-metallic compound of unshared electron pair to copper metal center (alkene), formula (3) alkynyl to be marked (alkynes) is selected from silane (silane) or silane for it. The NE indicated by the general formula (5) that following general formula (4) indicate. ;2 & gt of formula; ;(R 3) (R 4) C=C(R 5) (R 6);In the above-mentioned formula (2) of R 3, R 4, R 5 and R 6, each is identical or means other hydrogen (H), fluorine (F) or alkyl, perfluoroalkyl or alkoxy (alkoxy) with 1 to 6 carbon atom. ;3 & gt of formula; ;R 7 Cr Cr 8;In equation 3, the respective identical or different expression hydrogen (H) of R 7 and R 8 or alkyl, perfluoroalkyl or alkoxy, have 1 to 6 carbon atom. ;4 & gt of formula; ;(R 9) (R 10) C=CH-(CHR 11) N- Si(or 12) 3;In the above-mentioned formula (4) of R 9, R 10, R 11 and R 12, R 10, R 11 and R 12 are respectively identical or mean other hydrogen (H), fluorine (F) or alkyl or with 1 to 4 carbon atom, the perfluorinated alkyl that n is 0-3. It indicates integer. ;5 & gt of formula; ;(R 10) C ε-(CHR 11) N- Si(or 12) 3;In formula 5, R 10, R 11 and R 12 are individually identical or different hydrogen (H), it refers to that fluorine (F) or alkyl with 1 to 4 carbon atoms or perfluorinated alkyl, n indicate 0 to 3do integer. ;6 & gt of formula; ;In 6 R of formula, R 1 and R 2 in public formula (I) R, R 1 and R 2 it is identical.
机译:对于使用一种在硅衬底上制造前体溶液的方法的本发明,该方法具有优异的铜布线膜,并且电阻率的薄层电阻和至半导体器件的布线材料被电子地电子沉积。离子法的溶液及其溶液以及在硅衬底上沉积铜膜的方法,将本发明溶解于下式(1),路易斯碱由式(2)至式(5)定义,式( 5)低于式(6)的路易斯酸定义的金属络合物或磨损前体溶液,其中铜箔增加物溶解在路易斯碱和路易斯酸性混合溶液中的化学物质中,并提供了制备方法化学物质。 ; 1>式;式1中,R 1选自氢(H),氟(F)或烷基,具有1至4的全氟烷基(全氟烷基),全氟芳基(全氟芳基),R 1和R 2为碳原子,每个碳原子独立地为1对于7至7烷基或全氟烷基,以下式(2)表示被定义为路易斯碱的L为烯烃,因为其可以将未共享电子对的有机或有机金属化合物提供给铜金属中心(烯烃),式(3)中待标记的炔基(炔)选自硅烷(硅烷)或硅烷。下述通式(4)表示的通式(5)表示的NE。 ; 2>公式; ;(R 3)(R 4)C = C(R 5)(R 6);在上述R 3的式(2)中,R 4,R 5和R 6相同或表示其他氢(H),氟(F)或具有1-6个碳原子的烷基,全氟烷基或烷氧基(烷氧基)。 ; 3>式; ; R 7 Cr Cr 8;在式3中,R 7和R 8的氢(H)或烷基,全氟烷基或烷氧基各自相同或不同的表示氢(H),具有1至6个碳原子。 ; 4>公式; ;(R 9)(R 10)C = CH-(CHR 11)N-Si(或12)3;在上述式(4)中,R 9,R 10,R 11和R 12,R 10 ,R 11和R 12分别相同或表示其他氢(H),氟(F)或烷基或具有1-4个碳原子,n为0-3的全氟烷基。它表示整数。 ; 5>公式; ;(R 10)Cε-(CHR 11)N-Si(或12)3;在式5中,R 10,R 11和R 12分别为相同或不同的氢(H),是指氟(F )或具有1-4个碳原子的烷基或全氟烷基,n表示0至3个整数。 ; 6>公式; ;在通式(I)的R 6,R 1和R 2中,R 1,R 1和R 2相同。

著录项

  • 公开/公告号KR20000020368A

    专利类型

  • 公开/公告日2000-04-15

    原文格式PDF

  • 申请/专利权人 UP CHEMICAL CO. LTD.;

    申请/专利号KR19980038968

  • 发明设计人 SHIN HYEUN KOOK;

    申请日1998-09-21

  • 分类号C23C16/06;

  • 国家 KR

  • 入库时间 2022-08-22 01:45:58

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