MULTI-CHIP PACKAGE OF LOC TYPE AND METHOD FOR MANUFACTURING MULTI-CHIP PACKAGE

摘要

PURPOSE: A multi-chip package of LOC type and a method for manufacturing the multi-chip package are provided to decrease the size and the thickness of the multi-chip package in order to harmonize with a trend of small goods. CONSTITUTION: A multi chip package of LOC type and a method for manufacturing the multi -chip package include a first and second chips(11,13), a lead(26), bonding wires(19,20), and a package body(21). One terminal of the lead(26) are spaced with a predetermined spacing. The side(12) for a bonding pad of the first chip(11) and the side(14) for a bonding pad of the second chip(13) are glued to one and other side of the lead(26), respectively. The bonding wires(19,20) are coupled with the bonding pads of the first and second chips and the corresponding lead electrically. An opposite side to the side for the first bonding pad is exposed.