TEST SOCKET OF BGA(BALL GRID ARRAY) DEVICE AND WAFER WHERE CSP(CHIP SCALED PACKAGE) DEVICE IS FORMED

摘要

PURPOSE: A test socket of a BGA(Ball Grid Array) device is provided which can prevent the separation or the variation of a solder ball due to a contact force. And, the test socket can connect a wafer where a CSP device is formed with a test equipment. CONSTITUTION: A test socket of a BGA device prevents the separation or the variation of a solder ball due to the contact force by contacting a contact so that a uniform force is applied to the surface of the solder ball during wiping operation to remove a natural oxide formed on the solder ball. And, also the test socket can connect a wafer where a CSP device is formed with a test equipment by making a module of contact which can apply a uniform force to a surface of the solder ball when connecting the solder ball on the wafer and the test equipment electrically. The test socket of the BGA device comprises a housing(10) where an installation part of the BGA device is formed and a number of contacts(20) penetrating holes are formed in the inside of the installation part, and the contact where a conductive material is deposited on the surface of the penetrating holes. And the wafer test socket comprises a wafer housing where an installation part installs the wafer and a contact module corresponding to the CSP device.