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BI-EPITAXIAL JOSEPHSON JUNCTION DEVICE USING HIGH TEMPERATURE SUPERCONDUCTING Y1BA2CU3O7-X(YBCO) THIN FILM, AND MANUFACTURING METHOD OF THE SAME
BI-EPITAXIAL JOSEPHSON JUNCTION DEVICE USING HIGH TEMPERATURE SUPERCONDUCTING Y1BA2CU3O7-X(YBCO) THIN FILM, AND MANUFACTURING METHOD OF THE SAME
The present invention relates to a bi-epitaxial Josephson junction device and a method of manufacturing the same. More particularly, the present invention relates to a bi-epitaxial Josephson junction using a high-temperature superconducting Y 1 Ba 2 Cu 3 O 7 -x (YBCO) junction device and a manufacturing method thereof. In the present invention, a single crystal (SrTiO 3 or LaAlO 3 ) substrate having a crystal constant similar to that of a high-temperature superconductor (YBCO) is cut at an angle of? ° with respect to the surface vertical vector of the c axis, YSZ layer) is deposited by rf sputtering method and half of the thin film layer (YSZ layer) is deposited on the b-axis tilt boundary of the third figure (b) or the b-axis twist boundary of the third figure (c) (CeO 2 ) deposited on the substrate by rf sputtering method, followed by photolithography and ion milling to form a twisted boundary, and a high-temperature superconductor (CeO 2 ) YBCO) film by dc sputtering to produce a Josephson junction device that can be integrated and yielded, and by cutting the substrate to a small, arbitrary angle with the c-axis for the surface vertical vector The junction angle can be adjusted, and a bi-epitaxial Josephson junction device having a good characteristic (high IcRn value) can be obtained.
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机译:双外延约瑟夫逊结器件及其制造方法技术领域本发明涉及双外延约瑟夫森结器件及其制造方法。更具体地,本发明涉及使用高温超导Y 1 Sub> Ba 2 Sub> Cu 3 Sub> O 7 -x Sub>(YBCO)结器件及其制造方法。在本发明中,将具有与高温超导体(YBCO)的晶体常数相似的晶体常数的单晶(SrTiO 3 Sub>或LaAlO 3 Sub>)衬底在200℃下切割。角度?相对于c轴的表面垂直向量为°,通过rf溅射法沉积YSZ层,一半薄膜层(YSZ层)沉积在第三幅图(b)的b轴倾斜边界上,或者通过射频溅射法沉积在基板上的第三图形(c)(CeO 2 Sub>)的b轴扭曲边界,然后通过光刻和离子铣削形成扭曲边界,并进行高温通过直流溅射法形成超导体(CeO 2 Sub>)YBCO)膜,以生产可以集成并屈服的约瑟夫森结器件,并通过将衬底切成与表面c轴成小的任意角度垂直矢量可以调整结角,并获得具有良好特性(高IcRn值)的双外延约瑟夫森结器件。
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