APPARATUS AND METHOD FOR ULTRASONIC BONDING LEAD FRAMES AND BONDING WIRES IN SEMICONDUCTOR PACKAGING APPLICATIONS

摘要

An ultrasonic bonder is disclosed for coupling a lead frame lead to an associated line on a substrate. In one aspect of the invention, the bonder comprises an ultrasonic transducer. The base supports the transducer at one end and the bonding means is attached at the other end. The bonding means are of a size suitable for engaging the lead frame leads such that the lead frame leads are easy to connect to the associated lines on the substrate. A pair of force sensors is located on the side opposite the longitudinal axis of the transducer. Each force sensor has a sensor axis disposed at an acute angle with respect to the longitudinal axis of the transducer for detecting the force supplied to the bonding means and for outputting a force signal representing the detected force. The controller receives the force signal and outputs a drive signal to the transducer to facilitate mechanically bonding the selected lead frame lead to its associated line. The bonding means is fixed to the bonding means end of the transducer such that the operation of the transducer results in the movement of the bonding means. The output drive signal is at least partly controlled based on the received force signal. Also disclosed is an ultrasonic bonder for coupling an integrated circuit die to associated wiring. Also disclosed are ultrasonic bonding and packaging methods for semiconductor devices using the described bonders.