首页> 外国专利> Ohmic contact, especially for p-type gallium nitride, e.g. in LEDs, laser diodes, photodetectors and microelectronic components, is produced by metal thermal oxidation to form a p-type semiconductor oxide

Ohmic contact, especially for p-type gallium nitride, e.g. in LEDs, laser diodes, photodetectors and microelectronic components, is produced by metal thermal oxidation to form a p-type semiconductor oxide

机译:欧姆接触,特别是对于p型氮化镓,例如通过金属热氧化生成p型半导体氧化物生产LED,激光二极管,光电探测器和微电子元件中的

摘要

An ohmic contact is produced by metal thermal oxidation on a semiconductor material to form a p-type semiconductor oxide. Independent claims are also included for the following: (i) an ohmic contact to a semiconductor comprising a mixture of p-type semiconductor oxide and metal; and (ii) an ohmic contact to a semiconductor comprising a p-type semiconductor oxide layer and a conductive layer. Preferred Features: The semiconductor material is p-AlxGayInxN (x, y, z = 0 to 1 exclusive and x + y + z = 1) and the p-type semiconductor oxide is NiO, MnO, FeO, Fe2O3, CoO, CrO, Cr2O3, CrO2, CuO, Cu2O, SnO, Ag2O, CuAlO2, SrCu2O2, LaMnO3, YBa2Cu4O8 or PdO.
机译:通过金属热氧化在半导体材料上形成欧姆接触,以形成p型半导体氧化物。还包括以下方面的独立权利要求:(i)与包括p型半导体氧化物和金属的混合物的半导体的欧姆接触; (ii)与包括p型半导体氧化物层和导电层的半导体的欧姆接触。首选功能:半导体材料是p-AlxGayInxN(x,y,z = 0至1排斥和x + y + z = 1),p型半导体氧化物是NiO,MnO,FeO,Fe2O3,CoO,CrO Cr2O3,CrO2,CuO,Cu2O,SnO,Ag2O,CuAlO2,SrCu2O2,LaMnO3,YBa2Cu4O8或PdO。

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