IC package and method for encapsulating an IC chip in such an IC package

摘要

Plural kinds of metal wiring patterns on which a lid is to be put are formed on a package body. The wiring patterns connected to an IC chip are changed depending upon the size of the lid which is put on the package body. Either of an IC chip operated by a single power supply and an IC chip operated by positive and negative power supplies can be packaged without changing the wiring patterns in the package.