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Pulsed DC sputtering method of thin film magnetic disks

机译:薄膜磁盘的脉冲直流溅射方法

摘要

A method and apparatus for depositing an underlayer and/or a magnetic thin film layer on a data storage disk are described. The sputtering power is supplied in the form of pulses during the application of the underlayer and/or magnetic storage to periodically ignite the plasma and increase the charge-carrier density in the sputtering chamber. The repetition frequency and parameters for the pulses and pauses between pulses are adjusted to achieve a desired nominal value for the coercive field strength of the magnetic layer. Preferably the repetition frequency of the power switching is from 10 to 80 kHz and the ratio of pulse length to pulse pause is within 5:1 to 1:5.
机译:描述了一种用于在数据存储盘上沉积底层和/或磁性薄膜层的方法和设备。在施加底层和/或磁存储期间以脉冲形式提供溅射功率,以周期性地点燃等离子体并增加溅射室中的电荷载流子密度。调节脉冲的重复频率和参数以及脉冲之间的停顿,以实现磁性层的矫顽场强度的期望标称值。优选地,功率开关的重复频率为10至80kHz,并且脉冲长度与脉冲停顿的比率在5∶1至1∶5内。

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