首页> 外国专利> Method of sputtering a carbon protective film on a magnetic disk by superimposing an AC voltage on a DC bias voltage

Method of sputtering a carbon protective film on a magnetic disk by superimposing an AC voltage on a DC bias voltage

机译:通过在直流偏置电压上叠加交流电压在磁盘上溅射碳保护膜的方法

摘要

A carbon film for protecting a magnetic disk is sputtered by a DC magnetron sputtering method, with the addition of superimposed AC power on the DC power applied to the carbon target. When the carbon film is sputtered for extended period in a production sputtering machine, nodular growth occurs over the sputtering surface of the carbon target. Such nodules are variously called "warts" or "mushrooms" in the industry and they are detrimental to the productivity of the sputtering machine. The size and quantity of the nodules over the target surface increase as the target is sputtered longer, and because these regions do not contribute to sputtering, the efficiency of the target decreases. As sputter efficiency decreases, power input must be increased to the target to make up for the loss in the effective sputtering area of the target. Eventually, the power input must be increased to a point where arcing occurs continuously and sputtering cannot be continued. By superimposing AC power onto the DC power applied to the target, virtually all arcing on the carbon target is eliminated, thereby significantly reducing the nodular growth and extending the use of the target.
机译:通过直流磁控溅射法溅射用于保护磁盘的碳膜,并在施加到碳靶材的直流电上叠加交流电。当在生产溅射机中长时间溅射碳膜时,在碳靶的溅射表面上发生结节状生长。这些结节在工业上被不同地称为“疣”或“蘑菇”,它们对溅射机的生产率有害。随着靶材的溅射时间延长,靶材表面结节的大小和数量增加,并且由于这些区域对溅射没有贡献,因此靶材的效率降低。随着溅射效率的降低,必须增加对靶材的功率输入,以弥补靶材有效溅射面积的损失。最终,必须将功率输入增加到连续发生电弧且不能继续溅射的地步。通过将交流电源叠加到施加到靶材的直流电源上,实际上消除了碳靶材上的所有电弧,从而显着减少了结核状结节并扩大了靶材的使用范围。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号