Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high- injection surface photovoltage

摘要

Probe structures for testing electrical interconnections to integrated circuit devices and other electronic components; particularly to testing integrated circuits devices with high density area array solder ball interconnections. The probe structure is formed from a substrated have a surface, with at least one electrical contact location having a perimeter which is raised above the surface, and a location within the boundaries of said perimeter which is raised above the surface.