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Chemically removable Cu CMP slurry abrasive
Chemically removable Cu CMP slurry abrasive
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机译:化学可去除的Cu CMP浆料研磨剂
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摘要
Abrasion of Cu metallization during CMP is reduced and residual slurry particulate removal facilitated by employing a CMP slurry containing a dispersion of iron oxide particles having high solubility in dilute acids. Embodiments include CMP Cu metallization with a slurry containing iron oxide particles and removing residual iron oxide particles after CMP with an organic acid, such as oxalic acid or acetic acid, or a dilute inorganic acid, such as hydrochloric, boric or fluoroboric acid.
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