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Fine pitch component placement and solder paste stenciling method and apparatus for PC board repair
Fine pitch component placement and solder paste stenciling method and apparatus for PC board repair
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机译:用于印刷电路板修复的细间距元件放置和锡膏印刷方法及装置
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摘要
An apparatus and method for aligning fine pitch electrical components and for solder paste stenciling includes a template for aligning an electrical component and for aligning a solder stencil. The template has a window with shelves on opposite sides. Tape is adhered to the shelves across the window and is used to secure the template to the desired location on the printed circuit board. The template also includes upright tabs that engage notches in the edges of the stencil for aligning the stencil. A two headed vacuum lifting device is used to lift an aligned component and an aligned stencil from the template. With the template removed from the printed circuit board, the stencil is replaced in the aligned position for solder application. The stencil is removed and the electrical component is placed for soldering.
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