HEAT-RESISTANCE LOW DIELECTRIC CONSTANT THIN FILM, FORMATION METHOD THEREFOR, SEMICONDUCTOR INTERLAYER INSULATING FILM MADE OF THE HEAT-RESISTANCE LOW DIELECTRIC CONSTANT THIN FILM, AND SEMICONDUCTOR DEVICE USING THE SEMICONDUCTOR INTERLAYER INSULATING FILM

摘要

PROBLEM TO BE SOLVED: To provide a thin film that has improved heat resistance, has low dielectric constant, and can be applied to a semiconductor element, electrical circuit components, or the like. SOLUTION: This heat-resistance low dielectric constant thin film is composed of molecules, whose element symbols are B, N, and H, has a composition which satisfies 0.7 number of N atoms 1.3 and 1.0 number of H atoms 2.2 for one atom of B, and has a dielectric constant of 2.4 or less.