METHOD AND DEVICE FOR APPLYING ADHESIVE PASTE FOR DIE BONDING

摘要

PROBLEM TO BE SOLVED: To prevent an adhesive paste for die bonding from running like a thread, when applying the adhesive paste and to prevent a short circuit from being developed between the lead frames and die surfaces.;SOLUTION: A lead frame 13 in a device 10 for applying an adhesive paste for die bonding is carried by a rail 15 for carrying a lead frame, and at a paste applying stage, an adhesive paste 12 is put on an island portion 17 to be die-bonded by a syringe 11, in which the paste is stored. Here, an ultrasonic vibration generator 16 is attached to the bottom part of the lead frame at the adhesive paste putting stage and is operated to apply ultrasonic vibrations.;COPYRIGHT: (C)2001,JPO