PASTE APPLYING DEVICE FOR DIE BONDING AND PASTE APPLYING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a paste applying device for die bonding which can be cleaned easily after paste application as well as a paste applying method.;SOLUTION: This paste applying device for die bonding applies a paste 7 for die bonding to a substrate by discharging the paste 7 from an application nozzle 18. In this device, the paste 7 or a cleaning liquid is selectively supplied to a discharge pump 16a from a paste container 26A for storing the paste 7 and a cleaning liquid container 26B for storing the cleaning liquid which cleans the interior of a paste flow channel by selecting either of a second valve 28A, a third valve 39 or a fourth valve 28B. When the interior of the paste flow channel is cleaned after the end of applying the paste 7, the cleaning liquid is sucked with the discharge pump 16a and then is discharged from the application nozzle 18. Thus, it is possible to easily perform the cleaning operation of the interior of the paste flow channel after application without disassembling the paste applying device.;COPYRIGHT: (C)2001,JPO