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PHOTOREACTION PROCESSING METHOD AND PHOTOREACTION PROCESSING DEVICE

机译:光处理方法及光处理装置

摘要

PROBLEM TO BE SOLVED: To provide a photoreaction processing method and device constituted in such a manner that the finer processing to a workpiece is made possible and a degree of freedom in processing may be expanded in the smallest possible form. ;SOLUTION: In the photoreaction method of etching the workpiece W consisting of a non-metallic material by irradiating the workpiece with radiation light of a wavelength to induce a non-thermal reaction, the desired position at the surface to be processed of the workpiece W is irradiated with the radiation light arbitrarily regulated in the irradiation time or irradiation intensity and luminous flux from a desired bearing, by which the progression direction and depth of the etching are controlled. If the form of directly irradiating the workpiece W with the radiation light is adopted in the manner described above, the need for the mask of the prior examples is eliminated. Even more, the free variable setting of the irradiation bearing of the radiation light to the workpiece W is made possible and therefore there is no need for limiting the progressing direction of the etching.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种光反应处理方法和装置,其构成为使得可以对工件进行更精细的处理,并且可以以最小的可能形式扩大处理的自由度。 ;解决方案:在光反应法中,通过用一定波长的辐射光照射工件以诱导非热反应来蚀刻由非金属材料制成的工件W,在工件W的待加工表面上的所需位置用在照射时间或照射强度和来自所需轴承的光束中任意调节的辐射光照射,从而控制蚀刻的进行方向和深度。如果以上述方式采用用辐射光直接照射工件W的形式,则不需要现有示例的掩模。更重要的是,可以自由设定辐照光对工件W的照射方向,因此无需限制蚀刻的进行方向。;版权所有:(C)2001,JPO

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