MANUFACTURE OF SEMICONDUCTOR MEMBER, UTILIZATION METHOD FOR SEMICONDUCTOR BASIC SUBSTANCE, MANUFACTURE SYSTEM FOR SEMICONDUCTOR MEMBER, PRODUCTION CONTROL METHOD THEREFOR AND UTILIZING METHOD FOR FORMING DEVICE FOR FILM DEPOSITING

摘要

PROBLEM TO BE SOLVED: To efficiently and economically utilize semiconductor wafer.;SOLUTION: First processes (S11, S12) where a first member having a nonporous layer on a semiconductor base substance is prepared, and second processes (S13, S14) where the nonporous layer is transferred from the first member onto a second member, are contained. This is performed (n-1) number of times (n is a natural number not less than two) such that the semiconductor basic substance obtained by separating the nonporous layer from the first member in the second process is re-used as the component of the first member in the first process, and the first and second processes are repeated (n) times, then the semiconductor base substance separated in the second process of n-th time is used for uses other than the first and second processes.;COPYRIGHT: (C)2000,JPO