FLATLINE METHOD OF DRYING WAFERS

摘要

Drying of particulate materials, such as wood chips (wafers/strands) forthe manufacture of oriented structural board, as well as bark and the like.The methodis characterized by advancing wafers in random array and superposed andwithoutcontact above a planar surface; forcing heated air upwardly through spacedapartholes defined in the stationary planar surface and through the random array ofadvancing wafers, while evacuating heated air and accumulated moisture abovetheadvancing wafers. The method is distinguished by lateral shielding duringforcing ofheated air above the planar surface, so as to inhibit "blow-holes" among thedryingwafers.