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METHOD OF FORMING A THIN METAL LAYER ON AN INSULATING SUBSTRATE
METHOD OF FORMING A THIN METAL LAYER ON AN INSULATING SUBSTRATE
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机译:在绝缘基板上形成薄金属层的方法
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摘要
The invention is directed to the formation of a very thin, uniform metal layer (306) on a resin substrate (307) such as a copper layer on an epoxy-based substrate. Such copper/resin laminates (306, 307) are useful, for example, as blanks for forming printed circuitry.
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