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A CARRIER HEAD WITH EDGE CONTROL FOR CHEMICAL MECHANICAL POLISHING
A CARRIER HEAD WITH EDGE CONTROL FOR CHEMICAL MECHANICAL POLISHING
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机译:具有边缘控制功能的化学研磨抛光头
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摘要
A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.
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