A CARRIER HEAD WITH EDGE CONTROL FOR CHEMICAL MECHANICAL POLISHING

摘要

A carrier head (100), particularly suited for chemical mechanical polishing of a flatted substrate (10), includes a flexible membrane (118) and an edge load ring (120). A lower surface (192) of the flexible membrane (118) provides a receiving surface for a center portion of the substrate (10), whereas a lower surface (202) of the edge load ring (120) provides a receiving surface for a perimeter portion of the substrate (10). A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.