METHOD FOR PRODUCING ELECTRONIC CIRCUIT DEVICE JIG FOR MAKING SOLDER RESIDUE UNIFORM JIG FOR TRANSFERRING SOLDER PASTE AND APPARATUS FOR PRODUCING ELECTRONIC CIRCUIT DEVICE

摘要

A manufacturing method of an electronic circuit device is disclosed. The manufacturing method of the electronic circuit includes removing the defective semiconductor device from the substrate once the semiconductor device once mounted on the wiring substrate is defective, A repair process for mounting a semiconductor device is included. This repair process removes excessive residues of the solder metal residues remaining on the lands of the substrate from which the defective semiconductor device is removed, thereby remaining a uniform amount of the solder metal residues on the lands. Making; Positioning the new semiconductor device with the substrate; And melting the brazing metal residue and the protruding electrodes of the new semiconductor device uniformly remaining on the lands to connect the new semiconductor device to the substrate.