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Apparatus for fabricating semiconductor devices used by multiple electrode

机译:用于制造多电极使用的半导体器件的设备

摘要

The present invention, as in a plasma uniformity control condition according to the semiconductor device manufacturing facility using a multi-electrode such that the semiconductor device manufacturing process consists, in a process chamber in which a predetermined process for producing a semiconductor device is performed, the process chamber are installed such that the wafer is placed inside the lower side, being respectively connected to the plurality of first attenuator supplied with a single first power supply impedance matched power is being supplied, and a lower electrode formed of a plurality of electrodes installed, the interior of the process chamber It is provided on the upper side, being each connected to a plurality of the second attenuator being supplied with a single second power supply impedance is matched power is made is provided with a top electrode composed of a plurality of electrodes.
机译:在根据根据使用多电极的半导体器件制造设备的等离子体均匀性控制条件的情况下,本发明使得半导体器件制造工艺包括在其中执行用于制造半导体器件的预定工艺的工艺室中。处理室被安装成使得晶片被放置在下侧的内侧,分别被连接到被供应有单个第一电源阻抗匹配功率的多个第一衰减器,并且被安装有由多个电极形成的下部电极,处理室的内部设置在上侧,每个连接到被提供有单个第二电源阻抗的多个第二衰减器,并且被匹配以提供功率,并且设有由多个电极组成的顶部电极。

著录项

  • 公开/公告号KR100295430B1

    专利类型

  • 公开/公告日2001-07-12

    原文格式PDF

  • 申请/专利权人 NULL NULL;

    申请/专利号KR19990038767

  • 发明设计人 김도형;김한성;

    申请日1999-09-10

  • 分类号H01L21/306;

  • 国家 KR

  • 入库时间 2022-08-22 01:12:15

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