Micromechanical components fabrication method, involves forming structuring layer on substrate and subsequent etching of sacrificial layer

摘要

Manufacture of micromechanical components, as based on forming one or more sacrificial layers (2) on a silicon substrate (1) and then generating a silicon layer (3) thereon for forming structuring (10,11), and with later etching away of the sacrificial layer (2) or layers requires particularly precise management of the internal stresses in the structure and involves temperature treatment for the implanted dopant material to be incorporated into the silicon crystal lattice, with the distribution of the dopant material in the structure and, therefore, the internal mechanical stresses, tailored as required.