Re-wiring foil of surface-mount device (SMD) housing for integrated circuit

摘要

A re-wiring foil includes a foil mask (5) having at least one recess (90, in which at least one conductor path (4), having at least one connection surface (pad)(8), is provided on at least a first main side (8) of the foil mask (5). The pads (8) are positioned on the recess (9) sites, and the foil masks (5) are spaced from a substrate (2) by at least the conductor paths (4). Solder balls (6) are mounted on the pads (8), away from a second main surface of the foil masks. The connection surfaces (pads)(8) opposite the first main surface have a bulge in the direction of the second main surface, the diameter of the bulge being less than the diameter of the recess (9). More specifically, the bulge is cruciform in shape.