Structure-optimized fan-out of surface-mount device (SMD) electronic components for design layout of circuit boards

摘要

A method for fan-out of electronic components for the design or layout of circuit boards, in which the design or layout is computed according to: a = ps (1); b = vp-ps-cmax (2); where cmax = c pc/2 with an even number of pins; and cmax = c (pc-1)/2 with an odd number of pins; c = (vv-pp) tan(asin(tt/vv) (3); x = cc(pc-1)/2 (4); where ps = spacing of terminals (7) to the edge of the SMD-pads (6); pc = number of pins (5) in a row; pp = spacing of the pins (5) from one another; vv = spacing of test points (2) to one another; vp = spacing of test points (2) from terminal (7); tt = spacing of circuit boards (4) from one another. The surface covered by the fan-out is minimized in dependence of the number of pins (pc), the spacing of the test points from the terminal (vp), and the spacing of the test points from one another (vv).