Light-emitting semiconductor component manufacturing method has semiconductor layer structure with metal layer structured for providing contacts combined with carrier having further contact layer

摘要

The semiconductor component manufacturing method has a semiconductor substrate (S1) provided with an etching stop layer (S2), a light-emitting layer sequence (S4,S5,S6) and a metal layer which is structured for forming a number of contacts, before combining with a carrier having a metal layer which is structured for forming a second set of contacts.