Method for fabricating MOS transistor having raised source and drain

摘要

A process for fabricating a semiconductor device comprising a raised source and drain. A semiconductor device is fabricated by a process comprising the following steps: forming active regions separated by isolation regions; forming at each active region a gate electrode structure; depositing a first dielectric layer and a second dielectric layer; removing the top portion of the second dielectric layer to expose the portion of the first dielectric layer that covers the gate electrode structure; forming on the substrate a patterned resist layer to mask portions of the second dielectric layer; forming trenches next to the gate electrode structure by removing the unmasked portions of the second dielectric layer; filling the trenches with a conductor; doping the conductor with dopants; and driving the dopants into the substrate to form the raised source and drain.