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Method of measuring free carrier concentration and/or thickness of a semiconductor and process of manufacturing semiconductor device and semiconductor wafer using such method

机译:测量半导体的自由载流子浓度和/或厚度的方法以及使用该方法制造半导体器件和半导体晶片的工艺

摘要

The invention provides a method of measuring a carrier concentration and/or thickness of a semiconductor, which includes the steps of determining the carrier concentration by optical measurement means using a light having at least a frequency band which causes light absorption by free carriers in the semiconductor. A reflection amplitude ratio and a phase of the light or the result of measurement of substitute parameters therefor are obtained by the optical measurement means, and the carrier concentration and/or thickness is determined based on the reflection amplitude ratio and the phase or said result of measurement of the substitute parameter therefor.
机译:本发明提供一种测量半导体的载流子浓度和/或厚度的方法,该方法包括以下步骤:通过光学测量装置使用至少具有引起半导体中的自由载流子吸收光的频带的光,通过光学测量装置来确定载流子浓度。 。通过光学测量装置获得光的反射振幅比和相位或者其替代参数的测量结果,并且基于反射振幅比和相位或所述结果确定载流子浓度和/或厚度。为此测量替代参数。

著录项

  • 公开/公告号US6153444A

    专利类型

  • 公开/公告日2000-11-28

    原文格式PDF

  • 申请/专利权人 MURATA MANUFACTURING CO. LTD.;

    申请/专利号US19970921829

  • 发明设计人 KENJI TANIGUCHI;HIROYUKI NAKANO;

    申请日1997-09-02

  • 分类号H01L21/66;

  • 国家 US

  • 入库时间 2022-08-22 01:06:28

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