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Controlled cleavage thin film separation process using a reusable substrate
Controlled cleavage thin film separation process using a reusable substrate
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机译:使用可重复使用的基材的可控裂解薄膜分离工艺
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摘要
A technique for forming films of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define donor substrate material (12) above the selected depth. Energy is provided to a selected region of the substrate to cleave a thin film of material from the donor substrate. Particles are introduced again into the donor substrate underneath a fresh surface of the donor substrate. A second thin film of material is then cleaved from the donor substrate.
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