Method of fabricating solder-bearing silicon semiconductor device and circuit board mounted therewith

摘要

A circuit board mounted with a semiconductor device is fabricated by forming on a silicon substrate at least one first metal layer, overlaying a second metal layer to completely cover the first metal layer, covering the whole surface of the second metal layer with an insulating material, etching the insulating material to open a window at a prescribed region of the surface of the second metal layer, selectively imparting adhesiveness to the portion at the window, adhering solder powder to the adhesive portion, melting the solder powder by heating to form a solder bump, selectively imparting adhesiveness to at least one electrode portion of a wiring board, adhering solder powder to the adhesive portion, melting the adhered solder powder by heating to form a solder bump on the electrode portion, and contacting and fusing the solder bump of the silicon substrate and the solder bump of the wiring board so as to form and maintain a prescribed gap between the silicon substrate and the wiring board.