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InPSb channel HEMT on InP for RF application

机译:InP上的InPSb通道HEMT,用于RF应用

摘要

A high electron mobility transistor (HEMT) includes a substrate comprising indium phosphide and an optional buffer layer immediately adjacent the substrate. A channel layer immediately is adjacent the buffer layer, with the channel layer comprising indium phosphide antimonide and characterized by a formula of InPxSb(1−x), wherein x is about 0.85. The channel layer has a thickness of about 120 Angstroms. A Schottky layer is immediately adjacent the channel layer and a contact layer is immediately adjacent the Schottky layer. The transistor is characterized by a breakdown field of about 400 kV/cm and a saturated velocity of about 8.2×106 cm/s.
机译:高电子迁移率晶体管(HEMT)包括一个包含磷化铟的衬底和一个紧邻该衬底的可选缓冲层。沟道层紧邻缓冲层,该沟道层包含磷化铟锑化物,并且其特征在于式为InP x Sb (1&min; x),其中x为约0.85。沟道层具有约120埃的厚度。肖特基层紧邻沟道层,接触层紧邻肖特基层。该晶体管的特征在于击穿场约为400kV / cm,饱和速度约为8.2×10 6 Supcm / s。

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