首页> 外国专利> An InPSb channel HEMT on InP for RF applications

An InPSb channel HEMT on InP for RF applications

机译:InP上的InPSb通道HEMT,用于RF应用

摘要

A high electron mobility transistor (HEMT) (10) includes a substrate (11) comprising indium phosphide and an optional buffer layer (12) immediately adjacent the substrate (11). A channel layer (13) immediately is adjacent the buffer layer (12), with the channel layer (13) comprising indium phosphide antimonide and characterized by a formula of InPxSb(1-x), wherein x is about 0.85. The channel layer (13) has a thickness of about 120 Angstroms. A Schottky layer (14) is immediately adjacent the channel layer (13) and a contact layer (15) is immediately adjacent the Schottky layer (14). The transistor (10) is characterized by a breakdown field of about 400kV/cm and a saturated velocity of about 8.2 x 106 cm/s.
机译:高电子迁移率晶体管(HEMT)(10)包括一个包含磷化铟的衬底(11)和一个紧邻该衬底(11)的可选缓冲层(12)。沟道层(13)紧邻缓冲层(12),沟道层(13)包含磷化铟锑化物,并且其特征在于式为InPxSb(1-x),其中x为约0.85。沟道层(13)的厚度约为120埃。肖特基层(14)紧邻沟道层(13),并且接触层(15)紧邻肖特基层(14)。晶体管(10)的特征在于击穿场约为400kV / cm,饱和速度约为8.2×106cm / s。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号