Mirror surface chamfer device null

摘要

PROBLEM TO BE SOLVED: To provide a specular chamfering device capable of surely and quickly polishing the chamfered parts of wafers. ;SOLUTION: In a specular chamfering device 1 for wafers W, which includes a sucker 8 for sucking and supporting the wafer W, a first motor 9 for driving and rotating the sucker 8, a cylindrical or columnar polishing buff 2 having a polishing groove 2a for receiving the chamfered part of the wafer W and for specular polishing the chamfered part, a second motor 5 for driving and rotating the polishing buff 2 about a central axis, and an abrasive supply device for supplying an abrasive, the polishing groove 2a is provided in such a way as to be tilted relative to a plane perpendicular to the central axis.;COPYRIGHT: (C)1997,JPO