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CONDUCTOR PASTE, POWDER MATERIAL FOR PREPARING IT, AND MANUFACTURING METHOD FOR CERAMIC ELECTRONIC COMPONENT

机译:导体浆料,制备用粉末材料及陶瓷电子部件的制造方法

摘要

PROBLEM TO BE SOLVED: To expand an application range of conductor paste such as Ag paste.;SOLUTION: This conductor paste can be used for both conductor film formation for a baked alumina substrate and conductor film formation for a baked zirconia substrate. The paste contains conductive powder comprising a noble metal or an alloy containing a noble metal as a main constituent, metal oxide powder containing bismuth oxide as a main constituent, vitreous powder containing zinc bismuth borosilicate glass as a main constituent, and an organic vehicle.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:扩大导体浆料(如银浆)的应用范围;解决方案:该导体浆料既可用于烘焙氧化铝基板的导体膜形成,也可用于烘焙氧化锆基板的导体膜形成。该糊剂包含以贵金属或以贵金属为主要成分的合金构成的导电性粉末,以氧化铋为主要成分的金属氧化物粉末,以硼硅酸锌铋的玻璃为主要成分的玻璃状粉末以及有机载体。版权:(C)2002,日本特许厅

著录项

  • 公开/公告号JP2002270035A

    专利类型

  • 公开/公告日2002-09-20

    原文格式PDF

  • 申请/专利权人 NORITAKE CO LTD;

    申请/专利号JP20010072382

  • 发明设计人 NAGAI ATSUSHI;TOMITA HIDEYUKI;

    申请日2001-03-14

  • 分类号H01B1/22;H05K1/09;H05K3/12;

  • 国家 JP

  • 入库时间 2022-08-22 00:59:49

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