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SYSTEM AND METHOD FOR FINDING OPERATION/TOOL CAUSING INTEGRATION DEFECT IN SEMICONDUCTOR MANUFACTURING FACILITIES
SYSTEM AND METHOD FOR FINDING OPERATION/TOOL CAUSING INTEGRATION DEFECT IN SEMICONDUCTOR MANUFACTURING FACILITIES
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机译:查找半导体制造设施中的操作/工具引起集成缺陷的系统和方法
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摘要
PROBLEM TO BE SOLVED: To provide a method for finding a pair of operation/tool to defects in semiconductor-manufacturing facilities for treating a semiconductor wafer lot.;SOLUTION: To each lot in a lot list to the operation/tool of a candidate operation/tool list, specific positive and negative weighting values are assigned to conforming and nonconforming lots, respectively. A pair of operation/tool is selected form the candidate operation/tool list. The weighting value of each lot in a first lot list is successively added for forming a first accumulation value, a first peak accumulation value is formed as the maximum, first accumulation value during an addition process, a second accumulation value is formed in the same manner, and a second peak accumulation value is assigned. Each pair of operation/tool is ranked according to a peak combined accumulation value where the first peak accumulation value is added to the second one. The largest peak combined accumulation value tends to generate the defects.;COPYRIGHT: (C)2002,JPO
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