POLISHING PLATE FOR MIRROR POLISHING SILICON WAFER AND METHOD FOR MIRROR POLISHING SILICON WAFER

摘要

PROBLEM TO BE SOLVED: To provide a polishing plate for mirror polishing a silicon wafer having a small surface roughness unevenness in a surface of the wafer, that is, excellent mirror polishing uniformity and a method for mirror polishing the wafer.;SOLUTION: The polishing plate for mirror polishing the silicon wafer comprises a plastic plate in which the overall contact surface area with the polishing surface of the wafer is substantially uniformly roughed. The method for mirror polishing the silicon wafer comprises the steps of fixing the polishing plate for mirror polishing the wafer onto a surface plate of a polishing unit or a lapping unit, and mirror polishing the wafer while supplying a polishing agent slurry between the wafer and the polishing plate.;COPYRIGHT: (C)2002,JPO