MULTILAYERED LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a multilayered lead frame which is provided with a heat spreader and has a light weight as compared with the conventional lead frame and the manufacturing time which can be shortened from that of the conventional lead frame, and to provide a semiconductor device using the lead frame. SOLUTION: In the multilyered lead frame 408 constituted by laminating the heat spreader 403 and inner leads 402 upon another, bent sections 402b which are bent in perpendicular direction to the semiconductor element mounting surface of the heat spreader 403 are formed on the ways of the inner leads 402 to their front ends, and the front end sections of the leads 402 are bonded to the peripheral edge section of the semiconductor element mounting surface of the spreader 403.