Multi-level stacked semiconductor bear chips with the same electrode pad patterns

摘要

The present invention provides a semiconductor device comprising a plurality of semiconductor bear chips staked over a substrate, each of the semiconductor bear chips having top and bottom surfaces, each of the top and bottom surfaces of each of the semiconductor bear chips having both plural signal pads and plural chip select pads, wherein the plural chip select pads are aligned at a constant pitch in a first direction, and adjacent two of the plural semiconductor bear chips are displaced by a first distance corresponds to the constant pitch in the first direction.